Name Post Curing Oven
Function Max. 250℃
Configuration Condenser, PLC
Heat Source Infrared, Hot Air Convection
Width 1500
Height 1970
Length 4700
Total Power 20KW

The industrial ovens are widely used in 3C electronics and semiconductors various manufacturing processes and testing procedures.Such as:

  • 1. Baking components: Certain electronic components, such as moisture-sensitive devices or epoxy-based materials, require baking to remove moisture or cure the epoxy. An oven provides controlled heating conditions for this purpose.
  • 2. Aging and testing: Ovens are used to simulate accelerated aging and testing of electronic devices. By subjecting the devices to elevated temperatures, manufacturers can assess their performance and reliability over time.
  • 3. Environmental testing: Ovens can be used to conduct environmental testsasuch as thermal cycling, humidity testing, or temperature/humidity stress testing. These tests help evaluate the ability of electronic devices to withstand different environmental conditions.
  • 4. Drying and curing: Ovens are used to dry or cure coatings, adhesives, and encapsulants applied to electronic components, PCBs and other semiconductors. The controlled heating ensures proper drying and curing, resulting in improved performance and reliability.