Specifications:

Standard Features

  • High-Performance Thermal Regulation
    Powerful recirculating fans deliver consistent and uniform temperature distribution throughout the chamber, meeting the precision requirements of standards such as MIL-STD-883D. The airflow system also effectively dissipates heat generated by active test loads.

  • Easy Fixture Integration
    The rear wall is designed for quick disassembly, allowing convenient routing and installation of power leads or feed-through boards, which simplifies custom fixturing and setup.

  • Optimized Horizontal Airflow
    Supports traditional horizontal loading with side-to-side airflow, ensuring a uniform thermal environment across all horizontally arranged components.

  • Built-In Over-Temperature Protection
    Safety control automatically monitors chamber temperature and disables the heating system if the preset limit is exceeded, protecting both equipment and test specimens.

  • User-Friendly Temperature Controller
    Intuitive controller interface with arrow-key navigation for easy setpoint adjustments. Programmable shortcut keys (EZKeys) enable fast execution of frequently used operations.

  • Integrated Ethernet Connectivity
    Offers seamless communication with PCs or PLCs via Modbus TCP/IP, enabling efficient remote monitoring, data logging, and process control.

Burn-in Cabinet Oven Overview

This burn-in oven is specifically engineered for high-power semiconductor reliability testing, including forward bias, reverse bias, static and dynamic burn-in of ICs, RAM, ROM, microprocessors, and other electronic components.


Key Features

Efficient Heat Management
High-capacity recirculating fans ensure uniform thermal distribution across the chamber, maintaining temperature consistency as required by demanding standards such as MIL STD 883D, while effectively dissipating heat from active devices.

Simplified Fixture Integration
Rear panel can be easily removed to streamline the installation of power leads or signal feed-through assemblies, facilitating custom test setups.

Optimized Airflow Design
Utilizes a horizontal airflow pattern from side to side, ensuring even temperature and atmosphere flow over horizontally loaded devices. Horizontal loading also supports ergonomic and space-efficient handling.

Built-in Safety Controls
Equipped with over-temperature protection that automatically shuts off heating if temperature exceeds the user-defined limit. A secondary high-limit backup system offers additional safety in case of primary control failure.

User-Friendly Interface
Temperature controller features intuitive arrow-key navigation for setting adjustments, and programmable shortcut keys ("EZ-Keys") for frequently used operations. Communication options include EIA 232/485 Modbus® RTU, allowing seamless integration with PCs or PLC systems for data access and control.


Additional Functional Advantages

  • Compatible Power Supply Enclosure: Power supply bay matches standard 19-inch EIA rack and is visually aligned with the oven for integrated use, offering a 78-inch (198 cm) vertical working space.

  • Enhanced Load Capacity: High dissipation capacity allows greater live load handling without temperature instability.

  • Energy-Efficient Ventilation: Automatic damper regulates fresh air intake for energy conservation and process stability.

  • Accelerated Cooling: Rapid cool-down capabilities shorten cycle times and increase throughput.

  • Access and Mobility: Rear access port facilitates instrumentation connections, while bottom-mounted casters enable easy repositioning on the production floor.

  • Safety Door Switch: Automatically disables heater and fan when the chamber door is opened to protect operators and devices.

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